Apply to China Innovation Tour
Join us applying to China Innovation Tour powered by our strategic partner Plug&Play, global tech accelerator.
The tour developed to helping more international startups understand the latest innovation environment and market conditions in China.
All expenses paid for 3 selected startups from CEE (Ukraine, Belarus, Lithuania, Latvia, Estonia, Romania, Poland).
Deadline for application: September, 7th.
Dates of the tour: September 22-27, 2019.
Tech Pool CEE is a platform to connect founders, innovators from Eastern Europe to investors, accelerators and mentors from China.
Plug&Play is a Silicon Valley based global tech accelerator with Innovation Centers all around the world.