PCB Features (so far) determined from IC #1
- Hotswap
- RGB Underglow
- USB-C main connection and for the split connections
- Encoder support, placement still not determined though.
- F-row and Number pad areas will be detachable to allow for PCB flexibility.
- F-Row and Number pad will have un-soldered hotswap sockets to save cost if the customer plans to toss this section anyway. However, the hotswap sockets are easy to solder, and I will be offering soldering services for a very reasonable fee for people that don’t care to solder those sockets on.
- If we can’t quite make the layout options shown work with the hot swap, they will also not be soldered from the factory, and allows for more customization. Again, I will be offering soldering services for those that don’t care to solder the sockets on.

What we can’t change about the PCB is mainly the microprocessor. As of today QMK does not support split layouts on the newer ARM MCUs so we are stuck with Atmega for this. This is not a downside per se, just clearing up the design choice. Also USBC is almost a requirement for PCBs these days, so we want to stick with that. Unfortunately, ISO support will also not be available.

Gondo will also load the PCB with his latest features, such as:
- Overcurrent and overvoltage protections;
- ESD (Electrostatic Discharge) protection on data lines;
- TVS (Transient Voltage Suppressor) on the bus voltage power feed;
- Isolation from MCU and bus power rails by means of a pi-filter;
- PCB will be open-sourced and released under the Acheron Project.