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Manuscript submission data ISET2023
We are collecting the data for the manuscript submission path between Scientific.Net and AEJ (UTM Press)
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Conference ID number:
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Corresponding author name:
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Scientific.Net with Scopus-indexed publications “Key Engineering Materials/Solid State Phenomena/Materials Science Forum/Defect and Diffusion Forum”
Scientific.Net with Non-Scopus-indexed publications “Advances in Science and Technology/Construction Technologies and Architecture/Engineering Innovation/Engineering Chemistry/Diffusion Foundation and Materials Application/Applied Mechanic and Materials/Advanced Materials Research/Journal of Metastable and Nanocrystalline Materials/Advance Engineering Forum
UTM Press with Scopus-indexed publications “ASEAN Engineering Journal” (Recommended for international participants and AUNSEED.Net Consortium Member Universities members)
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